Dishing Study on Chemical Mechanical Planarization (CMP)
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)(2024)
Abstract
Dishing as the unavoidable side effect in the process of CMP has an important impact on the wafer loading and process window. Dishing always comes from the high selective ratio of slurry. The paper [1] [2] presented the dishing theoretical model and the influence factor, and offered the direction for the improvement of dishing in CMP. Furthermore, the experiment in the paper shows that the surrounding and location of monitor pad designed for dishing characterization also play an important role in dishing quantification.
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Key words
Chemical–mechanical Planarization,Experiments In This Paper,Processing Window,Atomic Force Microscopy,Linewidth,Area Data,Removal Rate,Atomic Force Microscopy Measurements,Combination Of Reactions
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