Dishing Study on Chemical Mechanical Planarization (CMP)

Dishing as the unavoidable side effect in the process of CMP has an important impact on the wafer loading and process window. Dishing always comes from the high selective ratio of slurry. The paper [1] [2] presented the dishing theoretical model and the influence factor, and offered the direction for the improvement of dishing in CMP. Furthermore, the experiment in the paper shows that the surrounding and location of monitor pad designed for dishing characterization also play an important role in dishing quantification.