Strengthened and toughened SiHfBCN-based high-temperature resistant adhesive with SiC NWs

To further improve the performance of binders, a SiHfBCN-based high-temperature resistant adhesive was successfully synthesized by Polymer-Derived Ceramics (PDC) route using TiB2, Polysiloxane (PSO) and short SiC nanowires as fillers. The effect of short SiC nanowires on the adhesive strength at room temperature and high temperature, as well as the reinforcing mechanism was studied. Compared with the adhesive without SiC nanowires, after curing (at 170 ℃) and pyrolysis (at 1000 ℃) in air, the appropriate adding of SiC nanowires upgrades the room temperature and high temperature (at 1000 ℃ in air) adhesive strength to (12.50 ± 0.67) MPa (up by about 32%) and (13.11 ± 0.79) MPa (up by about 106%), respectively. Attractively, under the synergistic impact of the nanowire bridging, nanowire breaking, nanowire drawing and crack deflection, the optimized adhesive exhibits multi-stage fracture, causing the increscent fracture displacement.