Influence of Bismuth Addition on the Physical and Mechanical Properties of Low Silver/Lead-Free Sn-Ag-Cu Solder

The Sn–Ag–Cu (SAC) solders with low Ag content have been identified as promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. This study examines the impact of incorporating Bi element on the microstructure, thermal behavior, and mechanical performance of low-silver-content Sn-1.5Ag-0.7Cu (SAC157) solder alloy. Besides using the conventional cross-sectioned microstructure image, X-ray diffraction (XRD), differential scanning calorimetry (DSC) and tensile stress- strain techniques were used to investigate the microstructure, thermal and mechanical properties after the addition of Bi, respectively. The results demonstrate that adding of Bi could refine the microstructure, optimize the thermal properties, and improve the tensile strength. Meanwhile, the ductility of the solder alloys reduced evidently in comparison to the Sn-1.5Ag-0.7Cu solder. From the microstructural analysis, 0.5wt% Bi addition to SAC157 significantly enhanced the solid solution effect of Bi and refined β-Sn dendrite, as well as extended the eutectic area. Moreover, as the Bi addition increases to 5wt%, finely dispersed bismuth precipitates within the β-Sn matrix, along with an enlarged eutectic area, lead to a remarkable enhancement in both ultimate tensile strength and yield strength. The electrical resistivity was characterized by the four-point probe technique. The results show that the electrical resistivity of Bi-modified SAC157 solder alloy decrease from 13.9 to 9.8 μΩ cm with the addition of 5wt.% Bi. These improvements can be attributed to the solid-solution and precipitation strengthening effects induced by the presence of bismuth. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications.