Preparation and properties of phenolic foam modified with boric acid and organosiloxane by supercritical CO₂ technology

In this study, a silica boron modified phenolic resin foam (SiBPF) is prepared in a reactor under specific pressure and temperature and using supercritical CO2 (scCO(2)) as a physical foaming agent, to improve phenolic foam (PF) brittle and friable properties and avoid environmental pollution caused by conventional physical foaming. To determine the partially curing degree for foaming, the influence of partially curing time at partially curing degrees between 39.88% and 53.17% was studied. Further, through an orthogonal experimental method, the optimized foaming process parameters-partially curing time of 6 h, adsorption time of 9 h, foaming pressure of 1 MPa, and foaming temperature of 130 degrees C-were determined. The SiBPF, thus prepared under the optimized conditions, exhibited a density of 0.2356 g/cm(3), an average cell size of 86.66 mu m, and a cell density of 7.10 x 10(6) cells/cm(3). Its compressive strength was found to be 7.28 MPa, with a specific compressive strength of 30.90 MPa/gcm(-3). At 800 degrees C, the carbon residue rate, thermal decomposition temperature T-5%, and T-max reached 77.61%, 355.21, and 702.70 degrees C, respectively. The thermal conductivity of SiBPF was measured to be 0.0644 W/mK, with the rear temperature stabilizing at 60 degrees C on a hot platform of 100 degrees C.