A Single-Board Integrated Millimeter-Wave Asymmetric Full-Digital Beamforming Array for B5G/6G Applications

Engineering(2024)

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摘要
In this article, a single-board integrated millimeter-wave (mm-Wave) asymmetric full-digital beamforming (AFDBF) array is developed for beyond-fifth-generation (B5G) and sixth-generation (6G) communications. The proposed integrated array effectively addresses the challenge of arranging a large number of ports in a full-digital array by designing vertical connections in a three-dimensional space and successfully integrating full-digital transmitting (Tx) and receiving (Rx) arrays independently in a single board. Unlike the traditional symmetric array, the proposed asymmetric array is composed of an 8 × 8 Tx array arranged in a square shape and an 8 + 8 Rx array arranged in an L shape. The center-to-center distance between two adjacent elements is 0.54λ0 for both the Tx and Rx arrays, where λ0 is the free-space wavelength at 27 GHz. The proposed AFDBF array possesses a more compact structure and lower system hardware cost and power consumption compared with conventional brick-type full-digital arrays. In addition, the energy efficiency of the proposed AFDBF array outperforms that of a hybrid beamforming array. The measurement results indicate that the operating frequency band of the proposed array is 24.25–29.50 GHz. An eight-element linear array within the Tx array can achieve a scanning angle ranging from −47° to +47° in both the azimuth and the elevation planes, and the measured scanning range of each eight-element Rx array is –45° to +45°. The measured maximum effective isotropic radiated power (EIRP) of the eight-element Tx array is 43.2 dBm at 28.0 GHz (considering the saturation point). Furthermore, the measured error vector magnitude (EVM) is less than 3% when 64-quadrature amplitude modulation (QAM) waveforms are used.
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关键词
Full-digital beamforming array,Asymmetric structure,Single-board integrated,Beyond fifth-generation and sixth-generation (B5G/6G),Millimeter-wave (mm-Wave) communication,Complex modulation,Printed circuit board (PCB),Vertical connection
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