Effect of low power Er:YAG laser irradiation of CAD -CAM resin -based composites on resin bonding

Purpose: To investigate the effect of painless low -power Er:YAG laser irradiation of conventional and polymer-infiltrated ceramic network (PICN) type CAD -CAM resin-based composites (RBCs) on resin bonding. Methods: An Er:YAG laser system, phosphoric acid etchant, universal adhesive, RBC, and two types of CAD -CAM RBC block were used. Microtensile bond strength, fracture mode, scanning electron microscopy (SEM) observations of bonding interfaces and CAD -CAM surfaces, and surface roughness of ground and pretreated surfaces were investigated. As pretreatment methods, low -power Er:YAG laser irradiation and air-abrasion with alumina particles were used. Results: The effect of low-power Er:YAG laser irradiation of CAD -CAM RBCs on bonding to repair resin varied depending on the type of CAD -CAM RBCs.