Multidimensional Fiber‐to‐Chip Optical Processing Using Photonic Integrated Circuits

Laser & Photonics Reviews(2024)

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摘要
AbstractMultidimensional multiplexing technologies have been proven to be a promising scheme to meet the demands of high‐capacity optical interconnects and optical processing networks. However, challenges remain to realize multidimensional hybrid multiplexing data transmission and signal processing between few‐mode fiber transmission links and on‐chip optical processing networks, since the optical coupling between fiber and chip is almost exclusively in the single‐mode regime. Here, a multidimensional fiber‐to‐chip optical processing system is proposed and demonstrated for hybrid wavelength‐, mode‐, and polarization‐division multiplexing signals, where multidimensional coupling between few‐mode fiber transmission link and on‐chip multi‐mode processing network is realized by using a 3D photonic integrated (de)multiplexers on a glass chip as well as 2D photonic integrated (de)multiplexers on a silicon chip, and the on‐chip multidimensional optical processing network composed by parallel cascaded micro‐ring resonator array performs a function of reconfigurable optical add/drop multiplexer. By operating wavelength‐division multiplexing in conjunction with mode‐division multiplexing and polarization‐division multiplexing, the communication bandwidth of fiber‐to‐chip optical processing systems can be further scaled.
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