An Aging Monitoring Method of Bond Wires Based on Voltage Ringing Frequency Characteristics in IGBT Modules

This paper introduces a novel online aging monitoring method for bond wires in IGBT modules based on voltage ringing frequency characteristics. The synchronous Buck converter was selected as the IGBT module test system. The influence of the aging degree of upper bridge arm IGBT module on the voltage ringing peak frequency characteristics of the lower bridge arm IGBT module is studied during the switching transient. Considering the influence of junction temperature, power loop wires inductance and driving resistance on the ringing frequency characteristics, this paper measured the standard ringing frequency under the coupling conditions of each factor. Then a standard database under different working conditions is constructed, and the database is used as a criterion to complete the monitoring task. Finally, the converter-level aging monitoring method of bond wires is realized which is non-invasive and real-time. The experimental results show that the proposed method does not need additional equipment, which reduces the complexity of monitoring circuit and has universal applicability.