Electrochemical Delamination for Free-Standing Polypyrrole Doped with Dodecylbenzenesulfonate Films and the Effect of Substrate

Free-standing conducting polymer films, polypyrrole doped with dodecylbenzene sulfonate, were obtained with electrochemical delamination by using redox cycling to delaminate electropolymerized film from the substrate. The use of electrochemical delamination to obtain thinner films than mechanical peeling and the effect of different electropolymerization substrates was investigated. The free-standing films were characterized with electrochemical filling efficiency and scanning electron microscopy. Electrochemical delamination allowed thin free-standing films <10 mu m and <1 mu m thick to be obtained from 304 stainless steel and gold substrates, respectively. The thinnest films obtainable from 304 stainless steel were limited by the electropolymerization charge density needed for complete film growth and not by electrochemical delamination. The filling efficiency of the films did not appear to be decreased by electrochemical delamination. These findings show the utility of electrochemical delamination to obtain thin free-standing films that also have the benefits of electropolymerization.