Study of TSV Interconnection Structure Based on Coupled High Temperature and Random Vibration Loading Conditions

The reliability issues of TSV interconnect structures directly affect the performance of packaged devices. The reliability of TSV interconnected structures under high temperature and random vibration conditions is investigated, and the effect of changes in the parameters about the TSV structure on its reliability is studied. Five factors of TSV copper column diameter, TSV copper column height, TSV spacing, bump height and bump diameter were selected, and three level values were set under each factor to obtain 18 sets of test TSV parameter structure combinations for this experiment through orthogonal tests, and a finite element analysis model of the relevant size TSV interconnection structure was established to study the effects of the five influencing factors on the stress-strain of the TSV interconnection structure under high temperature and random vibration loading conditions at 125°C. The experimental results obtained. By studying the graph of the stress-strain distribution law of the TSV interconnection structure, the analysis shows that the stress at the top of the copper column of the TSV interconnection structure is greater than the rest under the coupled loading conditions of 125°C high temperature and random vibration. At the same time, after conducting a polar variance ANOVA on the experimental data to analyze the degree of influence as well as the significance, the gray correlation affecting the TSV interconnection structure was obtained, and the results showed that the TSV spacing affected the stress-strain of the TSV interconnection structure the most, followed by the TSV copper column diameter and bump diameter, and finally the TSV copper column height and bump height. This test provides the basis for future analysis of the effects of TSV packaging under coupled loading conditions of high temperature and random vibration, accelerating the development of the electronics packaging industry.