Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package

The warpage behavior of the package component is one of the important issues in the packing technology, which can induce surface defects and finally lead to the degradation of the product reliability. The warpage is mainly caused by the mismatch of thermal-mechanic properties of different materials. In this paper, we take advantage of a multi-scaled simulation for the packing component, focusing on the effect of epoxy molding compound (EMC) characteristics on the warpage, whose main filler is commonly based on silica. Firstly, a meso-scaled numerical model of silica-based epoxy composites is generated with randomly dispersed particulate fillers. The effective modulus and coefficient of thermal expansion (CTE) are simulated numerically considering various filler percentage, filler size, particle size distribution, size shape and size type. Based on the homogenization of the thermal mechanic properties of EMC, we further investigate the warpage behavior of the package component by finite element method (FEM). Thus, the dependence of the silica filler characteristics on the warpage is analyzed, which benefits the design of the formula of EMC in the future.