Research on Magnetorheological Ultra Precision Processing Technology and Key Technologies for Semiconductor Wafers

Abstract As a key process in the manufacturing of integrated circuit chips, the quality and effectiveness of wafer cutting directly affect the performance of the chip. Magnetorheological machining is a flexible machining technique that changes the rheological properties of polishing fluid through internal gradient electromagnetic fields, thereby achieving material removal and surface error correction. This article focuses on magnetorheological machining technology and conducts simulation and experimental research on wafers. By simulating the mechanical properties of the wafer surface under different polishing disc speeds, excitation gaps and particle sizes, the simulation obtained the optimal processing parameters through experiments and data analysis, and finally obtained a smooth wafer surface with a surface roughness of Ra 0.042 µm.