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Optimizing conformal shielding scheme with quantitative analysis

Zhang Xinyu,Li Jun, Yang Chenglin,Yuan Jian,An Huilin, Zhang Wenwen, Zhou Minghao

2023 24th International Conference on Electronic Packaging Technology (ICEPT)(2023)

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Abstract
Conformal shielding has emerged as a promising technique in recent years due to its advantages such as seamless shielding, minimal SiP area occupation, and good heat dissipation performance. However, the exploration of the effects of various structural parameters on shielding performance in conformal shielding schemes for SiP packaging, including material type, cavity thickness, and cavity defects, has been limited to qualitative analysis, which hinders actual production. To address this challenge, this paper proposes a quantitative analysis method to evaluate the factors affecting shielding effectiveness. The proposed method is used to optimize the conformal shielding structure design scheme, and test samples are prepared using this optimized scheme. The simulation and test results are in good agreement which demonstrates the effectiveness of the quantitative analysis method, verifying its feasibility for guiding actual design and production activities.
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Key words
Conformal shielding,System-in-Package,Electro Magnetic Compatibility,quantitative calculation
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