Preparation of MXene and its application in low temperature electrically conductive adhesive

Ti 3 C 2 T x /Ag/Cu composite conductive filler and silver-plated copper powder powder were used as performance enhancers for the conductive binder. The dendritic silver-plated copper powder powder is uniformly dispersed in the resin matrix, and its unique morphology makes it easy to contact with each other and form a conductive network, which provides a pathway for carrier transfer. In this study, it was found that the volume resistivity was 4.32 x 10 -4 SI center dot cm when the content of Ti 3 C 2 T x /Ag/Cu was 0.5 %, which indicated that the modified MXene synergized with the silver-plated copper powder powders contributed to the reduction of the volume resistivity of the ECAs (electrically conductive adhesives).