Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics

Wafer rotational grinding is widely used to thin silicon wafers and the grinding -induced residual stress distribution is desired to be known. However, it is difficult to obtain it directly by measurement since the variation of residual stress values of different locations tends to be submerged in the fluctuations of measured values. In this study, molecular dynamics was employed to obtain the residual stress states of ground monocrystalline silicon of different crystal directions. The actual cutting directions of the abrasive grains were obtained as the tangential directions of the abrasive grain ' s traces on the silicon wafer surface relative to the crystal coordinate system. It was found that the actual cutting direction of an abrasive grain along a single grinding trace would change from the center to the edge of the silicon wafer since the grinding traces are curved lines. The residual stress state at a specific point on the wafer surface was obtained by mapping the residual stress values obtained by molecular dynamics to the actual cutting direction. The residual stress distribution map was obtained successfully and any point of the ground silicon wafer could be known. The location of maximum residual stress was found to deviate from the [1 1 0] crystalline direction on the ground wafer due to the change in the actual cutting direction relative to it.