Temperature-leveling performance comparison of solid–solid phase change materials for thermal management of electronic chips in thin devicesMasaaki BABA, Hiroaki ISHIHARAJIMA, Koki ISHISAKA,Noboru YAMADA,Masatoshi TAKEDAJournal of Thermal Science and Technology（2024）引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
