Theoretical Study of Extreme Ultraviolet Pellicles with Nanometer Thicknesses

Solid-State Electronics(2024)

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摘要
Extreme ultraviolet (EUV) pellicles are required for EUV defectivity management in high volume manufacturing (HVM). Theoretical analysis of EUV pellicles of nanometer thickness is helpful for these fabrications. In this paper, for maximum transverse deflection, an analytical-numerical method is contrasted against the finite element method (FEM) due to the ratio of thickness and width length of EUV pellicles. The difference was increased at a thickness of micron unit. Single- and multiple-variable methods of linear regression in deep learning were used to overcome the ANSYS limitation based on FEM, such as the meshing of more than 10 μm thickness, and shear loading, an error in FEM resulting from the impact on the stiffness matrix caused by variations in the length-to-thickness ratio increases in the beam element, respectively.
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关键词
Transverse deflection,Pellicle simulation,EUV mask,EUV pellicle,EUV lithography,Extreme ultraviolet,Computational lithography
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