Disassembly of in-plastic embedded printed electronics

We explored a novel design -for -recycling method for encapsulated printed electronics in an injection -molded package that improves disassembly at End -of -Life (EoL). To this end, a non -adhering disassembly layer (NADL) was applied onto the printed circuitry and light -emitting diodes prior to injection molding. Surprisingly, the devices with a disassembly layer remained fully functional after injection molding, despite exposure to high shear forces and elevated temperatures. Facilitating the disassembly of an encapsulated electronic device using a weak link in the adhesion strength of the overmolded encapsulant invokes a contradiction: the possibility to remove the injected plastic from any underlying coating goes against the requirement of high adhesion over the entire surface area for structural strength and integrity during the harsh conditions expected by industry. To achieve balance between disassemblability and reliability, the adhesion strength of the overmolded encapsulant was tuned using vias in the coating design. To the author 's best knowledge, this is the first time design -forrecycling principles were successfully applied to such in -mold structural electronics devices. Accelerated lifetime tests at 85 degrees C/85% relative humidity for 1000 consecutive hours were conducted to study the reliability of devices realized with this design -for -recycling method. Mechanical disassembly of molded devices proceeded uniformly along the intended interface of NADL with molded polycarbonate resin and exposed the printed Ag and surface -mounted components, thereby demonstrating the possibility to perform subsequent and dedicated recycling on plastics and metals separately.