Research on technology and isothermal aging of double sided module convex interconnect

Amid the burgeoning demand for heightened power density, conventional single-sided power modules fall short of meeting the need. To address this challenge, dual-sided power modules with bidirectional heat dissipation emerge as an efficacious remedy. This investigation introduces an innovative convex pedestal structure for ceramic substrates, effectively addressing chip tilt during reflow processes. The proposed design ensures uniform dimensions for lead-free interconnections, achieved through an optimized interconnection process. The fabrication process for dual-sided modules with convex pedestals is meticulously outlined, unraveling the tilt control mechanism. The study also uncovers the interplay between the convex pedestal's shape and the growth of intermetallic compounds (IMCs). Additionally, the evolution of interconnection performance following equivalent aging is systematically analyzed. In essence, this paper presents a comprehensive exploration at the convergence of advanced power module design, thermal management, and interconnection reliability.