Characterization of Differential TMV Vertical Interconnects to 50ghz with Double Side Measurement
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
关键词
Data Transmission,Low Power Consumption,Heterogeneous Integration,Eye Diagrams,Solid Line,Difference In Loss,Insertion Loss,Optical Technology,Return Loss,Eye Height,Simulated Channel,Advanced Design System
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