Predicting Package Breaking Load of Thin BGA Packages Through Mechanical Modeling and Simulation
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
Key words
Mechanistic Model,Mechanical Simulations,Breaking Load,Ball Grid Array,High Load,Finite Element,Model Calibration,Finite Element Analysis,Core Material,Pack Size,Bending Load,Calibrated Model Parameters,3-point Bending,Maximum Force,Tensile Stress,Maximum Stress,Flexural Strength,Bending Test,Loading Speed,Substrate Side,3-point Bending Test,Contact Pairs,Higher Flexural Strength,Equivalent Layer,Load Drop,Mold Material,Support Span
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