Mechanism of Seebeck coefficient variation at the output of NiCr/NiSi thin film thermocouple with different wires

Zhihui Liu, Tengda Guo, Yongjun Cheng, Bi Wang, Kai Shen, Kai Hu, Jiankang Zhou, Chuanbing Zhang,Zixi Wang,Wanyu Ding

Journal of Physics: Conference Series(2024)

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摘要
Abstract In this paper, by using magnetron sputtering to prepare NiCr/NiSi thin film thermocouples, the static calibration method is used for NiCr/NiSi thermocouples with rapid temperature calibration experiments. Different temperature calibration curves are obtained. The Seebeck coefficient of NiCr/NiSi thin film thermocouples connected to NiCr/NiSi wires is significantly higher (41.39 μV/°C) than that of NiCr/NiSi wires (0 μV/°C). The Seebeck coefficient (41.39 μV/°C) of the NiCr/NiSi thin-film thermocouple connected to copper wire is significantly higher than that of the thermocouple connected to copper wire (0 μV/°C). The problem of the Seebeck coefficient of the K-type thermocouple is analyzed by experimental data, which provides the relevant parameter basis for the use of the K-type thermocouple. The method has the advantages of simple equipment, convenient operation, accurate and reliable data, and provides a basis for the sensor to measure the temperature measurement.
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