Influence of Patterns on Mechanical Properties of Ultrasonically Welded Joints in Copper Substrate and Wire

Ultrasonic wire welding is considered a method of choice for creating reliable interconnects in electronics industry including aerospace, batteries and electric vehicles. In this paper, ultrasonic welding tests between EVR252 copper wire and substrate are carried out. Novel pattern morphologies are machined on substrates to explore its influence on mechanical properties of welded joint. Patterns are divided into three different categories e.g., original surface, vertical and horizontal shapes. Cracks, microstructure strength and tensile properties of welded joint are studied and its joining mechanism is analysed. Compared with the reference substrate (S1), the welded joint performance of the longitudinal patterns (S2, S3, S4) has been improved, among which the longitudinal pattern (S4) has the most significant improvement (+ 15