Plasma characteristics and material erosion mechanism in multi-channel wire electrical discharge machining

Multi-channel wire electrical discharge machining (MC-WEDM) is an advanced and high-efficiency machining technology, but its material erosion mechanism remains unclear. In this study, dual-channel wire electrical discharge machining was utilized as a case study to investigate the impact of the plunging current on both the plasma characteristics and material erosion under complex discharge conditions. Force analysis was conducted on the charged particles in the plasma, revealing that the plunging current can influence the trajectory of the plasma by modifying the self-magnetic field. The particle tracking method was employed to simulate the motion of electrons, revealing that in MC-WEDM, electrons exhibited a larger and more uniform distribution. The evolution of the plasma within a single-pulse discharge was observed using high-speed photography technology, and the discharge signals collected from different channels were analyzed. It was observed that the plasma in MC-WEDM experienced more intense back-and-forth sweeping on the workpiece surface, facilitating the ejection of molten metal from the molten pool. The oscillating plasma exhibits a larger processing area and a more uniform distribution of energy, resulting in the formation of larger and shallower discharge craters. Furthermore, the influence of the amplitude and time point of the plunging current on the volume and area of the discharge craters was summarized. Finally, MC-WEDM significantly reduced the occurrence of holes and micro-cracks and exhibited a thinner recast layer in the continuous discharge experiment.