Glass fiber strengthened BNNS/ST/polyolefin composites with high dielectric constant and high thermal conductivity

Ceramics International(2024)

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摘要
The present research presents an examination of the consequential effects brought about by the introduction of short-cut E-glass fibers (GF) on the properties of high-dielectric constant, high-thermal conductivity microwave composite systems (xGF/(8-x)BNNS/78wt.%ST/polyolefin, x = 0-8wt.%, BNNS: hexagonal boron nitride nanosheets). The GF is modified using KH550, with the success of the surface modification definitively confirmed by X-ray Photoelectron Spectroscopy (XPS) and Fourier Transform infrared spectroscopy (FTIR). All components are found to exhibit consistently ultra-high and stable dielectric constants within the 8–12 GHz frequency range (Dk = 17.7–18.08). Based on thermogravimetry analysis (TGA) and dynamic mechanical analysis (DMA) results, the incorporation of modified GF improve the thermal stability of the composite materials, enhancing thermal decomposition temperature, residual carbon content and glass transition temperature. Furthermore, replacing BNNS with GF significantly amplifies the mechanical properties of the composite substrate. This substitution leads to a notable reduction in the coefficient of thermal expansion (CTE) in all directions while simultaneously increasing the bending and tensile strength. At the same time, the composites can maintain reasonably high thermal conductivity values. Overall, with a GF concentration of 4wt.%, the composite showcases an appreciable increase in dielectric constants (17.81), a high thermal conductivity (1.3 W/m·K) and enhances mechanical properties (cross-plane CTE: 15.44 μm/(m·°C), in-plane CTE: 26.06 μm/(m·°C), bending strength: 65.6 MPa, tensile strength: 17.42 MPa). Considering its superior performance metrics, the composite can be identified as an optimal choice for microwave composite dielectric substrate material.
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关键词
Glass fiber,Microwave composite substrate,Mechanical properties,High-Dk,CTE,High thermal conductivity
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