Grinding force model for ultrasonic assisted grinding of -TiAl intermetallic compounds and experimental validation

The introduction of ultrasonic vibration in the grinding process of gamma-TiAl intermetallic compounds can significantly reduce its processing difficulty. It is of great significance to understand the grinding mechanism of gamma-TiAl intermetallic compounds and improve the processing efficiency by studying the mechanism of ordinary grinding of abrasive grains. Based on this, this study proposes a grinding force prediction model based on single-grain ultrasonic assisted grinding (UAG) chip formation mechanism. First, the prediction model of grinding force is established based on the chip formation mechanism of abrasive sliding ordinary grinding and the theory of ultrasonic assisted machining, considering the plastic deformation and shear effect in the process of material processing. Second, the UAG experiment of gamma-TiAl intermetallic compounds was carried out by using diamond grinding wheel, and the unknown coefficient in the model was determined. Finally, the predicted values and experimental values of grinding force under different parameters were compared to verify the rationality of the model. It was found that the maximum deviation between the predicted value of tangential force and the actual value is 23%, and the maximum deviation between the predicted value of normal force and the actual value is 21.7%. In addition, by changing the relevant parameters, the model can predict the grinding force of different metal materials under different processing parameters, which is helpful for optimizing the UAG parameters and improving the processing efficiency.