Controlled adsorption of gas molecules by tuning porosity of titanium film

Within microelectromechanical system sensors, the establishment of a vacuum environment is a prerequisite for the control of specific residual gas molecules. At the wafer-level package stage, the interior of the sensor can be easily converted into a vacuum environment. However, after packaging, degassing occurs due to the accumulation of fumes with additional processing, resulting in a significant reduction in sensor reliability. To counteract this, non-evaporable getter (NEG) film is commonly packaged together with the sensor to absorb the outgassing gas molecules and maintain a vacuum environment within the sensor. Most NEG films require an activation process to migrate the adsorbed gas molecules from the surface to the bulk by thermal annealing. Recently, NEG films have been considered to reduce the activation temperature and time to avoid heat damage. Depositing an anti-oxidant layer on NEG film or alloying the NEG film with metallic materials through co-sputtering to create a distinct valence state during activation was found to prevent further oxidation of NEG film. However, these methods require expensive materials and fabrication equipment. In this study, we demonstrate that a much lower activation temperature (T = 350 degrees C) and time (t = 10 min) for Ti NEG film can be achieved by controlling the surface morphology depending on the deposition method and condition, without requiring further treatment such as the deposition of a capping layer or co-sputtering. Increasing the grain size of the Ti NEG film results in a larger surface area, which enables more efficient adsorption of gas molecules. Additionally, higher porosity in the film increases the diffusion of gas molecules, thus enhancing the overall gas adsorption capacity. Our experiments show that the Ti NEG film, which was deposited at 7.8 angstrom s-1 using a sputtering method, exhibited a grain size of 411 nm and a surface roughness of 59.185 nm. Furthermore, after an activation process at 350 degrees C for 10 min, the atomic ratio of the adsorbed gas molecules was 23.14%.