An ultra-low loss fan-in/fan-out device for 19-core 5-mode fiber fabricated using the binding method

The fan-in/fan-out (FI/FO) device for multi -core fiber (MCF) is a necessary component to achieve large bandwidth, high-speed data transmission and stable fiber optic communication. However, currently available FI/FO devices usually suffer from high insertion loss and high manufacturing cost, which greatly limit their practical applications. To solve these problems, we fabricated a FI/FO device for a 19 -core 5 -mode fiber using the binding method. It has been experimentally demonstrated to support 5 modes with an ultra -low average insertion loss of 0.07625 dB. Being well -structured, our proposed FI/FO device has better performance and application prospects, which can be expected to contribute to the innovation and development of information and communication technology.