Electrical Characteristics of H-Diamond Transistors With ZrO $_{\text{2}}$ /Zr Stacked Dielectrics Deposited by Electron Beam Evaporation
IEEE Transactions on Electron Devices(2024)
Abstract
Enhancement mode diamond field-effect transistors with large threshold voltage and low leakage current are highly in demand for low-power electronics. In this article, hydrogen-terminated diamond (H-diamond) transistors with ZrO
$_{\text{2}}$
/Zr stacked dielectrics deposited by electron beam (EB) evaporation were demonstrated. The threshold voltages boosted from
$-$
0.4 to
$-$
2.5 V with gate length increasing from 2 to 8
$\mu $
m, indicating the normally-OFF operation. The OFF-state leakage current of 10
$^{-\text{8}}$
mA/mm and gate–source leakage current density of about 10
$^{-\text{7}}$
A/cm
$^{\text{2}}$
were acquired both for 6-and 8-
$\mu $
m gate length devices. Additionally, the ON/OFF ratio and subthreshold swing (
SS
) for the device with a 6-
$\mu $
m gate length were deduced to be 10
$^{\text{9}}$
and 128 mV/decade, respectively. The maximum drain current density increases with the gate length shortens and reaches up to
$-$
74 mA/mm for the device with a 2-
$\mu $
m gate length. These performances suggest that the EB method is applicable to fabricate the ZrO
$_{\text{2}}$
/Zr gate for realizing normally-OFF H-diamond FETs.
MoreTranslated text
Key words
FET,H-Diamond,normally-OFF,Zr,ZrO $_{\text{2}}$
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