A New High Density 3D Stackable Via RRAM for Computing-in-Memory SOC Applications

Siao-Ping Sing, Ya-Ching Wang,Wei-Hwa Lin,Yue-Der Chih,Yih Wang,Ya-Chin King,Chrong Jung Lin

IEEE Transactions on Electron Devices（2024）

引用 0|浏览22

关键词

Three-dimensional displays,Latches,Logic gates,Resistance,Voltage,Layout,Common Information Model (computing),Artificial synapse,CMOS logic,computing-in-memory (CIM),multiply-accumulate (MAC),neural network (NN),resistive random access memory (RRAM)

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