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State of the Art of Cu-Cu Hybrid Bonding

John H. Lau

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2024）

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Abstract
In this study, the state of the art of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges (opportunities), advantages and disadvantages, and examples of Cu-Cu bumpless HB. Also, some recommendations will be provided.
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Key words
Annealing,chemical-mechanical polishing (CMP),Cu-Cu bonding,dielectric bonding,hybrid bonding (HB)
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