Wideband Glass-Based Transitions from GCPW and SIW to RWG with High-Efficiency Mode Excitation for W-Band Compact Module Integration

In this paper, broadband W-band transitions from grounded coplanar waveguide (GCPW) and substrate integrated waveguide (SIW) to rectangular waveguide (RWG) based on through glass via (TGV) technology have been newly proposed for compact glass packages. In order to achieve efficient mode excitation and conversion, additional TGVs are embedded within the resonant cavity, and parallel stub-line coupling structures are incorporated in the bottom metal layer. The embedded TGVs and parallel stub lines excite multiple resonance modes within the resonant cavity, thereby enhancing the bandwidth of the transition. Besides, the glass substrate can be directly installed on the open-ended RWG ports to simplify manufacturing and assembly. Furthermore, a GCPW-to-RWG transition with 20.3% bandwidth and a SIW-to-RWG transition with 24.7% bandwidth are designed as examples in the W-band.