An Ultra-Miniature W-Band Bandpass Filter With Ultra-Stopband Based on 3-D TSV Technology

In this paper, an ultra- miniature W-band bandpass filter (BPF) with ultra-stopband using the three-dimensional integrated through silicon via (TSV) technology, is proposed. The proposed BPF construction is simply composed of two TSVs cascading front-side and back-side redistribution layers (RDL). An equivalent circuit model is used to analyze the parasitic parameters and evaluate the dimensions. According to the simulation results by the HFSS software, the proposed BPF has the miniaturized size of 1.2 x 1 x 0.042 mm(3) and the center frequencies at 110 GHz. The better transmission characteristics including insertion loss of 0.84 dB, and return loss of more than 20dB, and suppression of higher than 20 dB in W-band are presented respectively.