Compact Module Integration Technologies for Millimeter Wave and Terahertz Applications

Due to the applications of millimeter wave and terahertz technology in practical systems, compact and low-cost transceiver modules are required increasingly. Millimeter wave / terahertz modules and systems are always designed and assembled by separate components due to the limitations of fabrication processes. In recent years, some system-in-package (SiP) schemes have been proposed to improve the integration of front ends. In the special session, the key integration packaging technologies will be introduced and analyzed, and several typical packaging modules for millimeter wave and terahertz integration applications proposed by our and other research groups around the word will be concluded.