An Antenna-in-Packaged CMOS Transceiver Array for MU-MIMO Communications

This paper presents a millimeter-wave antenna-in-packaged (AiP) transceiver array for multi-user multiple-input-multiple-output (MU-MIMO) wireless communication. This AiP beamforming array is composed of a 1x4 antenna array and four CMOS RF front-ends, where the antenna array and CMOS chips are integrated with multilayer-organic substrates. The antenna array is made by four yagi-dipole antennas and the 90 nm CMOS front-ends include a) an up-conversion mixer and a driver amplifier, b) a low-noise amplifier (LNA) and a down-conversion mixer, and c) a frequency doubler for sub-harmonically pumped local oscillator (LO). The measured equivalent isotropically radiated power (EIRP) is -5.3 dBm at 50 GHz with the side-lobe level less than 11.7 dB and the 3-dB beamwidth is 25 degrees. The beam steering range is +/- 70 degrees.