Microstructure and Texture of Pure Copper under Large Compression Deformation and Different Annealing Times

In this study, the plastic deformation of pure copper under room-temperature compression and different annealing times was examined, and the microstructure and texture evolution were studied via scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and microhardness tests. The results showed that when the deformation degree was 93.75%, the microhardness increased from 76 HV (Vickers hardness) before deformation to 110 HV. After annealing, the hardness decreased with increasing annealing time, and the pure copper grain size could be refined from 150 mu m to 6.15 mu m. An increase in annealing time did not continue to promote recrystallization, while the effect on grain refinement was weakened. The geometrically necessary dislocation (GND) density decreased from 6.0 x 10(14)/m(2) to 4.83 x 10(14)/m(2) after annealing, which implies that static recrystallization occurs at the cost of dislocation consumption during the annealing process. The compression deformation of pure copper produced a strong deformation weave (<001> orientation), and a portion of the deformation weave within the material was transformed into a recrystallization weave (<111> orientation) after the annealing process.