Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process

Anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) consisting of a polymer matrix and a metal-coated polymer bead are introduced as interconnection materials in mini-LED display panel packaging through a thermal compression bonding process. However, this packaging solution has been leading to important problems such as alignment difficulties due to high bonding temperature and pressure, and its repair issues for bad LED devices after the bonding process. Recently, laser-assisted bonding (LAB) process for mini-LED display packaging has been introduced to solve these problems [Ref. 1–2]. This study introduces, an anisotropic solder paste (ASP) using conductive solder particles and applies it to the mini-LED packaging through the LAB process.