MEMS Mirror in Hermetic Package for Enhanced Performances

Marco Del Sarto,Luca Maggi,Amedeo Maierna,Mark Shaw,Roberto Carminati,Gianluca Mendicino,Davide Rotta,Marco Chiesa, Aina Serrano Rodrigo, Antonella Bogoni

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)（2023）

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摘要

Ceramic substrate coupled to metal lid has been selected for realizing hermetic package for MEMS mirror. The component passed the fine and gross leak tests and show good performance with improved Q-factor.

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关键词

MEMS mirror,hermetic package

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