Fully CMOS-Compatible Room-Temperature Waveguide-Integrated Bolometer Based on Germanium-on-Insulator Platform at Mid-Infrared Operating Beyond 4 μm

2023 International Electron Devices Meeting (IEDM)(2023)

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摘要
We propose a novel concept of an uncooled waveguide-integrated bolometer on a Ge-on-insulator (Ge-OI) platform at mid-infrared (MIR) wavelength of 4.18 μm. To induce heat generation, we introduce a heavily-doped (p + ) Ge that utilizes the mechanism of free-carrier absorption (FCA) in Ge. A bolometric material of H 2 plasma-treated TiO 2 film is integrated to facilitate highly efficient thermal-to-electrical conversion. The fabricated waveguide-integrated bolometer exhibits outstanding performance characteristics in the temperature coefficient of resistance (TCR) of - 1.911 %/K and a sensitivity of -22.25 %/mW at room temperature. Our proposed detector offers full complementary metal-oxide-semiconductor (CMOS) compatibility and features a remarkably simple device configuration. Moreover, due to its FCA-induced heating, we anticipate that our approach can cover the entire MIR regime without performance degradation. This work experimentally demonstrates a room-temperature waveguide-integrated bolometer operating beyond 4 μm, for the first time to our knowledge, paving the way towards the development of a fully integrated photonic platform capable of operating in the ultra-wide MIR spectral region.
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关键词
Bolometer,Device Configuration,Free Charge Carriers,Temperature Coefficient Of Resistance,Mid-infrared Wavelengths,Greenhouse Gas,Energy-dispersive X-ray Spectroscopy,Strong Absorption,Resistance Change,Optical Power,Electron Beam Evaporation,Atomic Layer Deposition,Thermal Detector,Resistance Of Film,Arrhenius Plot,Secondary Ion Mass Spectrometry,Photon Detection,Photonic Integrated Circuits,Silicon-on-insulator,Mid-infrared Range,Cut-off Wavelength
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