On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding

This paper presents a novel co -packaging approach through on -chip hybrid laser integration with photonic circuits using photonic wire bonding. The process involves diebonding a low-cost semiconductor distributed -feedback (DFB) laser into a deep trench on a silicon -on -insulator (SOI) chip and coupling it to the silicon circuitry through photonic wire bonding (PWB). After characterizing the power -current -voltage (LIV) and optical spectrum of the laser, a wavelength -current relationship utilizing its tunability through self -heating a swept -frequency laser (SFL) is developed. Photonic integrated circuit (PIC) resonators are successfully characterized using the SFL method, demonstrating signal detection with a quality factor comparable to measurements conducted with an off -chip benchtop laser.