A facile fabrication of an integrated electromagnetic interference shielding material with low electrical resistance based on silver particles/thermoplastic polyurethane composite@copper foil

As microelectronic technology advances, electronic devices have become faster and smaller. The electromagnetic radiation has negative effects on electronic device operation, how to eliminate the electromagnetic radiation has attracted much attention. Copper foil is the most commonly used and effective material for reducing electromagnetic radiation. In practical applications, it is necessary to use adhesive to fix it onto the surface of electronic devices. In this work, an integrated electromagnetic shielding material (AgPs/TPU@Cu hybrid film) was designed and prepared by a facile way, in which the mixture of silver particles (AgPs) and thermoplastic polyurethane (TPU) was cured to form a AgPs/TPU composite film on the surface of copper foil (Cu) by a one-pot heating press processing. The horizontal and vertical electrical resistances of AgPs/TPU composite film decreased to 0.2 Ω and 0.47 Ω at the AgPs loading of 38 wt%, respectively, and the corresponding thermal conductivity reached 0.81 W m−1 K−1. Moreover, the AgPs/TPU@Cu hybrid film at the AgPs loading of 38 wt% exhibited the maximum electromagnetic interference shielding effectiveness (EMI SE) value of 105 dB. This work provides valuable information about EMI shielding technologies for practical electronic applications.