A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications
IEEE ELECTRON DEVICE LETTERS(2024)
Abstract
To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 C-degrees under atmosphere with a bonding strength of 47.83 kgf/cm(2). Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.
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Key words
Bonding,Polyimides,Packaging,Fabrication,Surface treatment,Surface topography,Surface roughness,3DIC,advanced packaging,hybrid bonding,low temperature,RDL interposer
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