Terahertz Nondestructive Characterization of Conformal Coatings for Microelectronics Packaging
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY(2024)
摘要
Measuring the thickness of conformal coatings (CCs) and detecting defects in a nondestructive and noncontact fashion are important to ensure the reliability and performance of packaged electronic components and systems. In this study, we explore the application of terahertz (THz) time-of-flight tomography (TOFT), a noncontact and nondestructive method applied to conformal-coating thickness. We measure the time delay of THz pulses reflected (echoes) from fabricated structures covered by a CC to ascertain coating thickness. Orthogonal matching pursuit (OMP) is applied to deconvolve reflected THz signals from various interfaces, viz., air/CC and CC/substrate. By these means, we map the conformal-coating thickness distribution over significant areas. The CC thickness found over the metal area is similar to 64.3 mu m, while it is similar to 56.2 mu m over the metal-free area. Moreover, the Gaussian mixture model (GMM), a machine-learning algorithm, is used to detect a possible defect-rich region within the CC itself.
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关键词
Conformal coating (CC),Gaussian mixture model (GMM),heterogeneous packaging,machine learning,nondestructive evaluating,nondestructive testing,orthogonal matching pursuit (OMP),terahertz (THz)
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