Highly thermally conductive and soft thermal interface materials based on vertically oriented boron nitride film

Thermal interface materials (TIMs) with high through-plane thermal conductivity (TC), softness, and electrical insulation are highly desired for modern electronics. However, it is challenging to simultaneously achieve these properties. Boron nitride (BN)-based polymer composites are promising candidates for advanced TIMs owing to the high TC and great electrical insulation of BN. However, previous works perform either low TC (< 8 W m(-1) K-1) or high stiffness. The ultimate properties of BN-based TIMs remain largely unclear and unrealized. Here, we fabricate BN film -filled silicone rubber composites by a facile stacking-cutting method, which maintains the high degree of orientation the BN film, so that a record -high though-plane TC of 19.1 W m(- 1) K-1 and a low compressive modulus of 5.42 MPa are achieved. The low BN content (37 vol%) ensures the softness and resilience of the as-prepared TIMs. This work presents a highly efficient strategy to enhance the performance of BN based TIMs, promoting their large-scale manufacturing and practical applications.