Diamond deposition on AlN using Q-carbon interlayer through overcoming the substrate limitations

Q-carbon, a quenched form of carbon, is a recently discovered carbon structure that has tremendous properties, compatibility, and potential for use in device fabrication and other electronic and mechanical applications. However, the non-equilibrium nature of the synthesis process and a very small window of growth parameters have limited the formation of Q-carbon to only low thermal conductive substrates. This study aims to overcome these limitations through extensive tuning of the parameters of diamond-like-carbon (DLC), the base structure required for the formation of Q-carbon. The as-deposited DLC films demonstrate ID/IG ratios ranging from 0.12 to 1.67, which are obtained through the optimization of laser energy density, rep rate, and deposition temperature during pulsed laser deposition. Utilizing Simulation of Laser Interaction with Materials, pulsed laser annealing (PLA) was used to directly transform the DLC films into Q-carbon while varying the PLA energy density from 0.3 J/cm2 to 1.2 J/cm2. Findings of Q-carbon formation on sapphire using different DLC films assisted in the preparation of a roadmap for overcoming the substrate limitations for Q-carbon formation. Further, Q-carbon is formed on AlN substrates for the direct deposition of diamond films without the requirement of a non-carbon interfacial layer or nanodiamond seeding layer. The large-area and uniform diamond growth on Q-carbon shows well-faceted and five-fold twinned growth with a 70 % improvement in the residual compressive stress of diamond on AlN. Such a method of diamond deposition on AlN provides the opportunity to address the thermal management issues in wide- and ultra-wide bandgap high-power electronic devices.