SIW Bandpass Filter Based on TGV Technology for Millimeter-Wave Wideband Communications

2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)(2023)

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Abstract
In this paper, a compact bandpass filter based on TGV technology for millimeter-wave broadband applications is proposed. The configuration of TGV-based filter consists of half-mode substrate integrated waveguide (HMSIW) loaded with defected ground structure (DGS). Three pairs of face-to-face typical E-shaped DGS are employed to achieve trap characteristics, which can offer the benefits of small footprint and wide bandwidth. In addition, the adoption of HMSIW structure can further minimize the lateral size of the circuit. Besides, TGV technology by virtue of low loss and high accuracy not only improves insertion loss but also enhances the integration of devices, especially in the millimeter-wave band. Geometric numerical analysis, fabrication, and measurement for the HMSIW-DGS filter are performed to demonstrate the validity and advancement of the design. Good consistency can be observed from the simulated and measured response. From the response curves obtained, the proposed experimental prototype exhibits a bandwidth fraction of over 31.22% and only occupies a circuit area of 1.04λg×0.27λg. The designed filter is competitive in RF ICs due to its miniaturization and wide passband advantages.
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Key words
Through glass via (TGV),bandpass filter,half-mode substrate integrated waveguide (HMSIW),defected ground structure (DGS),millimeter-wave band
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