Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Gauri Karve, Yunlong Li, Vasyl Motsnyi, Wei Wei, Jakob Visker, Francois Chancerel, Jan Ackaert, Renaud Puybaret, Barundeb Dutta, Deniz Sabuncuoglu Tezcan, Lan Peng, Philippe Soussan, Simone Severi, Haris Osman

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials（2024）

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摘要

Co-integration of III-V and silicon on the same substrate can enable many applications in photonics, RF, imaging, and sensing. Wafer reconstitution (WARE) is an embedded multi-die integration platform that allows for the integration of heterogenous materials on 200/300 mm Si substrates. This paper describes an integration flow for InP dies attached to 200 mm silicon. Electrical measurements on InGaAs diodes fabricated on WARE wafers confirm that the performance is similar to devices on native InP substrates.

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