Hybrid integration of Polymer PICs and InP optoelectronics for WDM and SDM terabit intra-DC optical interconnects

Efstathios Andrianopoulos,Annachiara Pagano,Panos Groumas,Anna Chiado Piat,David de Felipe,Ute Troppenz,Madeleine Weigel,Martin Kresse,Michael Theurer,Christos Kouloumentas,Christos Tsokos,Zerihun Tegegne,Paraskevas Bakopoulos,Maria Massaouti, Giorgos Megas,Martin Moehrle,Patrick Runge,Norbert Keil,Hercules Avramopoulos

2023 SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE, IMOC（2023）

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摘要

This paper presents a hybrid photonic integration concept based on the use of a polymer motherboard, InP EML arrays and InP PD arrays to realize WDM and SDM Terabit optical engines operating at 100-Gb/s or even at 200-Gb/s per lane. The optical engines are aligned with the Ethernet roadmap, are cost-efficient by design and can find their place in the next generation Terabit IM/DD optical transceivers within Data Centers.

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关键词

hybrid photonic integration,EMLs,polymer PICs,optical transceivers,GbE

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