A CuCCu Wire-Bonding Enabled by a Cu-Selective Passivation Coating to Enhance Packaging Reliability
IEEE Transactions on Components, Packaging and Manufacturing Technology(2023)
Abstract
Semiconductor device packaging reliability specifications are tightening toward a low ppb to zero defect rate standard due to the increasingly stringent automotive safety requirements. When exposed to chloride ions contamination, the typical copper (Cu) to aluminum (Al) wire-bonding connection could be a potential source of corrosion-related reliability concerns in wire-bonded devices. This article studies the effect of replacing the Al bond pad with Cu on the corrosion-induced lift-off of wire bonds when exposed to low ppm levels of chloride contamination. Real-time immersion corrosion screening was carried out on a wire-bonded device for accelerated time-dependent observation of corrosion progression in 100-ppm chloride solution. The newly developed Cu-Cu wire-bonded devices, enabled by selective passivation to prevent Cu oxidation, dramatically outperformed Cu-Al wire-bonded devices in complete immersion in chloride solution. A chemically discerning reflection-absorption infrared spectroscopy (RAIRS) metrology was used to measure the oxidation suppression provided by a mere few nanometers of passivation coating.
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Key words
Coatings,Passivation,Oxidation,Wires,Corrosion,Bonding,Surface treatment,Chloride-induced corrosion,Cu-Cu wire-bonding,packaging reliability
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