Interconnect Reliability Simulation Analysis of Fan-out Package redistribution Layer

As a typical representative of advanced package, fan-out package has gradually become the main package form of advanced process chips, which has been widely used in consumer electronics and also has broad application prospects in high-reliability fields such as aviation, aerospace. Taking the fan-out package device as the research object, a finite element simulation model is established by ANSYS to evaluate the interconnection structure reliability of the redistribution layer under different geometrical parameters of the package. The simulation results are of great significance for the high reliability design and application of fan-out packages.